EM TXP Target Surfacing System
The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques.
An integrated stereomicroscope allows pinpointing and easy preparation of barely visible targets.
With the specimen pivot arm the sample can be observed directly at an angle between 0° and 60°, or 90° to the front face for distance determination with an eyepiece graticule.
Key Features
Integrated automatic process control
Integrated process control with automatic E-W guiding mechanism, force-regulated feed control and countdown function saves the user from time-consuming routine sample preparation.
Surface finish and target examination
Surface finish and target examination with the integrated stereomicroscope means that the user does not have to transfer the sample for distance estimation and surface evaluation, which increases user efficiency.
Variety of tool inserts
Variety of tool inserts allows the specimen to be milled, sawed, drilled, ground and polished without sample removal from the instrument. The ability to observe the process through the stereomicroscope results in time and cost savings.
Inspection of Multilayer Samples
Workflow in Quality Control: Combining the target surfacing system Leica EM TXP and the light microscope Leica DM2700 M allows to reduce the required procedure, streamline the workflow and produce reliable and precise results.
