EM TXP
Ion Beam Milling
Sample Preparation for Electron Microscopy
Products
Home
Leica Microsystems
EM TXP Target Surfacing System
Read our latest articles
Workflow Solutions for Sample Preparation Methods for Material Science
This brochure presents and explains appropriate workflow solutions for the most frequently required sample preparation methods for material science samples.
Cross-section Analysis for Electronics Manufacturing
This article describes cross-section analysis for electronics concerning quality control and failure analysis of printed circuit boards (PCBs) and assemblies (PCBAs), integrated circuits (ICs), etc.
Structural and Chemical Analysis of IC-Chip Cross Sections
This article shows how electronic IC-chip cross sections can be efficiently and reliably prepared and then analyzed, both visually and chemically at the microscale, with the EM TXP and DM6 M LIBS…
High-Quality EBSD Sample Preparation
This article describes a method for EBSD sample preparation of challenging materials. The high-quality samples required for electron backscatter diffraction are prepared with broad ion-beam milling.
How to Prepare and Analyse Battery Samples with Electron Microscopy
This workshop covers the sample preparation process for lithium and novel battery sample analysis, as well as other semiconductor samples requiring high-resolution cross-section imaging.
Cross Section Ion Beam Milling of Battery Components
Sample Preparation of Lithium battery systems requires high quality surface preparation to evaluate their internal structure and morphology. Due to the brittle materials involved, preparing pristine…
Battery Manufacturing
Battery manufacturing has several key challenges concerning inspection. Solutions for sample preparation and microscopic visual and chemical analysis are needed.
Fields of Application
Watchmaking Industry
Reflections are reduced with diffusers or polarization sets. Work smoothly and uninterruptedly with fast images from our digital microscope cameras with frame rates of up to 30 fps that provide crisp,…
Automotive & Aerospace
Discover advanced microscopy solutions from Leica Microsystems for quality control, failure analysis, and innovation in automotive, aerospace, railway, and shipbuilding.
Material Analysis Microscopes
Materials analysis requires microscope solutions for the imaging, measurement, and analysis of features across a variety of materials like metal alloys, semiconductors, glass and ceramics, as well as…
Industrial Microscopy Markets
Maximizing uptime and achieving targets efficiently help your bottom line. Leica microscope solutions can give you insights into the smallest sample details as well as analyze, document, and report…
Cross-Section Analysis for Electronics
Cross-section analysis for electronics enables detailed analysis of failure mechanisms of components like printed circuit boards (PCBs), assemblies (PCBAs), and integrated circuits (ICs).
Electronics and Semiconductor Industry
For electronics and semiconductors, solutions enabling efficient inspection, cross-section and cleanliness analysis, and R&D of PCBs, wafers, IC chips, and batteries are crucial.
Battery Manufacturing
Battery manufacturing has several key challenges concerning inspection. Solutions for sample preparation and microscopic visual and chemical analysis are needed.
