For the investigation reported here, the cross section of an IC chip was prepared with the EM TXP target surfacing system. With the EM TXP, samples can be mechanically milled, sawed, ground, and polished prior to microscopy and spectroscopy examination. The chip cross section was then analyzed for both internal structure and composition using the DM6 M LIBS 2-methods-in-1 material analysis solution. The DM6 M LIBS combines both high-resolution optical microscopy and laser-induced breakdown spectroscopy (LIBS), enabling structural and chemical analysis to be done at the same time.
The results presented show how an efficient overall workflow for advanced materials analysis of IC-chip cross sections can be achieved with the EM TXP and DM6 M LIBS solutions. The same workflow and solutions can be applied to other electronic components as well.
Key Learnings
This article provides users with:
- A step-by-step guide for the workflow concerning IC-chip cross sectioning as well as visual and chemical analysis
- Tips on using a target surfacing system for quick, reliable sample preparation of chip cross sections
- An example of efficient and reliable visual and chemical analysis of chip cross sections
- References to useful publications concerning advanced materials analysis of electronic components
